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FULL STACK CLOUD SOFTWARE ENGINEER - SHANNON, IRELAND - 483723
Shannon, Ireland
C++ R&D SOFTWARE ENGINEER (M/F/D) - HAMBURG - 487179
Hamburg, Germany
SERVICES PROJECT MANAGER - 486601
United Kingdom, Northern Ireland
ACCOUNT DEVELOPMENT EXECUTIVE - 487625
الدمام, Saudi Arabia
EMEA DIGITAL MARKETING COORDINATOR FOR ENERGY AND UTILITIES - 486807
Warsaw, Poland
EMEA DIGITAL MARKETING COORDINATOR FOR SOCIAL MEDIA - 486626
Warsaw, Poland
CUSTOMER SUCCESS MANAGER - 476914
Warsaw, Poland
QUALITY MANAGEMENT SPECIALIST - EMEA - 476308
Warsaw, Poland
SENIOR SOFTWARE ENGINEER - 488154
Yerevan, Armenia
SENIOR SOFTWARE ENGINEER - 488149
Yerevan, Armenia
JUNIOR QA ENGINEER - 488372
Yerevan, Armenia
QUALITY ASSURANCE ENGINEER - 488147
Yerevan, Armenia
SENIOR SOFTWARE ENGINEER - 488149
Yerevan, ArmeniaSiemens Digital Industries Software is driving transformation to enable a digital enterprise where engineering, manufacturing and electronics design meet tomorrow. Our solutions help companies of all sizes create and leverage digital twins that provide organizations with new insights, opportunities and levels of automation to drive innovation.
Siemens EDA is a global technology leader in Electronic Design Automation software. Our software tools enable companies around the world to develop highly innovative electronic products faster and more cost-effectively. Our customers use our tools to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board, and system design.
Job Responsibilities:
* Perform moderately complex development activities, including the design, implementation, maintenance, testing, and documentation of software modules and subsystems specifically for physical design, place and route, and 3D packaging.
* Develop scalable and custom solutions, streamline and automate workflows, and deploy robust production code using Python, Tcl/Tk, Bash, and other scripting tools and languages, focused on physical implementation and packaging.
* Problem-solving skills to identify complex physical design, packaging, tool, or flow issues and facilitate resolution.
* Improve physical design and packaging flows and methodologies for advanced technology nodes, focusing on performance, power, and area (PPA) optimization.
* Support integration and enhancement of flows related to floorplanning, placement, routing, power integrity, signal integrity, and physical verification for 3D-IC and advanced packaging.
* Work with CAD, 3D/2.5D packaging, and physical implementation teams to address workflow requirements and drive innovation in place & route and packaging solutions.
* Collaborate on the development and integration of 3DBlox, 3DStack, and industry standards-based solutions relevant to 3D-IC/3DStack architectures and advanced packaging.
* Manage design data and EDA infrastructure relevant to physical design and packaging, including tool installation/maintenance, server environment setup (Linux/Windows), resource monitoring, and solving
Qualifications:
* Bachelor's degree with 4+ OR Master's degree with 2+ years of experience in Computer Science, Computer Engineering, Electrical Engineering, or a closely related technical field.
* Strong knowledge of software development and coding in C++/Python, Tcl/Tk, and Shell/Bash.
* Strong understanding and extensive usage of software data structures and software development in Windows and Linux environments.
* Prior experience with Flow Managers/MakeFiles for building complex design structures and workflows.
* Proficiency in design data management and EDA infrastructure, including organizing large-scale design data, installing/upgrading EDA tools, and running server environments.
* Deep understanding of ASIC physical design methodology from RTL Synthesis through Physical Implementation (floorplanning, placement, routing, CTS, timing closure, physical verification), with Netlist-to-GDS flow expertise.
* Familiarity with version control systems (e.g., Git) and software development methodologies (e.g., Agile, Scrum).
* Ability to work independently and collaboratively within a team with minimal supervision.
* Advanced English speaking and writing skills for effective distributed team communication.
Preferred Skills & Experience:
* Direct experience with industry-leading Place & Route tools (e.g., Cadence Innovus, Synopsys Fusion Compiler/ICC2, Siemens Aprisa) and physical verification tools (e.g., Siemens Calibre DRC, LVS, PEX).
* Familiarity with Package Design tools (e.g., Cadence APD/SiP, Siemens Xpedition) and Package / Interposer planning solutions (e.g., Siemens Innovator 3D IC, Cadence Integrity/Innovus, Synopsys 3DIC Compiler).
* Experience with 3D-IC/3DSTACK solutions and related physical implementation challenges.
* Familiarity with IC analysis tools such as Siemens HyperLynx, Ansys HFSS and Redhawk, Cadence Voltus, or Synopsys PrimeTime for signal and power integrity analysis in physical design.
* Knowledge of advanced process nodes (e.g., FinFET technologies) and their impact on physical design.
We are Siemens:
A collection of over 377,000 minds building the future, one day at a time in over 200 countries. We're dedicated to equality, and we encourage applications that reflect the diversity of the communities we work in. All employment decisions at Siemens are based on qualifications, merit, and business need. Bring your curiosity and creativity and help us shape tomorrow!
We offer a comprehensive reward package which includes a competitive basic salary, bonus scheme, generous holiday allowance, pension, and private healthcare.
Transform the everyday
Accelerate transformation
#LI-EDA
#LI-Hybrid
Job Responsibilities:
* Perform moderately complex development activities, including the design, implementation, maintenance, testing, and documentation of software modules and subsystems specifically for physical design, place and route, and 3D packaging.
* Develop scalable and custom solutions, streamline and automate workflows, and deploy robust production code using Python, Tcl/Tk, Bash, and other scripting tools and languages, focused on physical implementation and packaging.
* Problem-solving skills to identify complex physical design, packaging, tool, or flow issues and facilitate resolution.
* Improve physical design and packaging flows and methodologies for advanced technology nodes, focusing on performance, power, and area (PPA) optimization.
* Support integration and enhancement of flows related to floorplanning, placement, routing, power integrity, signal integrity, and physical verification for 3D-IC and advanced packaging.
* Work with CAD, 3D/2.5D packaging, and physical implementation teams to address workflow requirements and drive innovation in place & route and packaging solutions.
* Collaborate on the development and integration of 3DBlox, 3DStack, and industry standards-based solutions relevant to 3D-IC/3DStack architectures and advanced packaging.
* Manage design data and EDA infrastructure relevant to physical design and packaging, including tool installation/maintenance, server environment setup (Linux/Windows), resource monitoring, and solving
Qualifications:
* Bachelor's degree with 4+ OR Master's degree with 2+ years of experience in Computer Science, Computer Engineering, Electrical Engineering, or a closely related technical field.
* Strong knowledge of software development and coding in C++/Python, Tcl/Tk, and Shell/Bash.
* Strong understanding and extensive usage of software data structures and software development in Windows and Linux environments.
* Prior experience with Flow Managers/MakeFiles for building complex design structures and workflows.
* Proficiency in design data management and EDA infrastructure, including organizing large-scale design data, installing/upgrading EDA tools, and running server environments.
* Deep understanding of ASIC physical design methodology from RTL Synthesis through Physical Implementation (floorplanning, placement, routing, CTS, timing closure, physical verification), with Netlist-to-GDS flow expertise.
* Familiarity with version control systems (e.g., Git) and software development methodologies (e.g., Agile, Scrum).
* Ability to work independently and collaboratively within a team with minimal supervision.
* Advanced English speaking and writing skills for effective distributed team communication.
Preferred Skills & Experience:
* Direct experience with industry-leading Place & Route tools (e.g., Cadence Innovus, Synopsys Fusion Compiler/ICC2, Siemens Aprisa) and physical verification tools (e.g., Siemens Calibre DRC, LVS, PEX).
* Familiarity with Package Design tools (e.g., Cadence APD/SiP, Siemens Xpedition) and Package / Interposer planning solutions (e.g., Siemens Innovator 3D IC, Cadence Integrity/Innovus, Synopsys 3DIC Compiler).
* Experience with 3D-IC/3DSTACK solutions and related physical implementation challenges.
* Familiarity with IC analysis tools such as Siemens HyperLynx, Ansys HFSS and Redhawk, Cadence Voltus, or Synopsys PrimeTime for signal and power integrity analysis in physical design.
* Knowledge of advanced process nodes (e.g., FinFET technologies) and their impact on physical design.
We are Siemens:
A collection of over 377,000 minds building the future, one day at a time in over 200 countries. We're dedicated to equality, and we encourage applications that reflect the diversity of the communities we work in. All employment decisions at Siemens are based on qualifications, merit, and business need. Bring your curiosity and creativity and help us shape tomorrow!
We offer a comprehensive reward package which includes a competitive basic salary, bonus scheme, generous holiday allowance, pension, and private healthcare.
Transform the everyday
Accelerate transformation
#LI-EDA
#LI-Hybrid




